congatec, a provider of embedded and Edge computing solutions, has unveiled new COM Express Compact Computer-on-Modules featuring AMD Ryzen Embedded 8000 Series processors. These modules, powered by up to eight ‘Zen 4’ cores, the advanced XDNA™ NPU, and Radeon RDNA 3™ graphics, offer exceptional performance with up to 39 tera operations per second (TOPS) for AI inference tasks.
This makes the conga-TCR8 Type 6 modules particularly attractive for high-volume, cost-sensitive applications requiring a blend of AI, graphics, and computational power. Industries such as medical imaging, test and measurement, AI-driven POS/POI systems, and professional gaming can take advantage of these long-term available modules to drive innovation while ensuring investment protection.
Offering a scalable thermal design power (TDP) range from 15 to 54 watts, these modules are ideal for upgrading existing designs, enabling companies to enhance product lifecycles, return on investment, and sustainability by simply replacing outdated modules.
“Our new AMD Ryzen Embedded 8000-based modules not only expand our range of high-performance Edge AI platforms for innovative applications, but also offer developers easy access to system consolidation benefits in the aReady.COM variant,” explained Martin Danzer, Director Product Management at congatec. “This new processor platform, featuring powerful CPU, GPU, and NPU cores, is perfectly suited for such consolidation. Customers and users benefit from cost, efficiency, and reliability advantages thanks to a configured hypervisor, pre-installed operating systems, accompanying IoT software for enhanced functionality, and flexible expansion options.”
Detailed features
The conga-TCR8 modules are available with four different AMD Ryzen Embedded 8000 processors, offering six or eight ‘Zen 4’ cores. They support up to 128GB of DDR5-5600 memory with error correction code (ECC), making them well-suited for data-critical and data-intensive applications. Equipped with AMD’s XDNA™ NPU (offering 16 TOPS) and Radeon RDNA™ 3 graphics, they deliver combined processing power of up to 39 TOPS and feature AI computing capabilities with up to 12 compute units. The modules also support immersive graphics on up to four displays, with resolutions reaching 8K.
For fast connectivity, they include six PCIe Gen 4 lanes, three DisplayPort interfaces, one eDP or LVDS, four USB 3.2 Gen 2 ports, and four USB 2.0 ports. Audio can be delivered via HAD, while storage is supported through two SATA 6 Gb/s ports or an optional NVMe SSD. Additional embedded interfaces such as SPI, UART, I2C, and GPIO complete the package.
The modules are also offered as application-ready aReady.COM solutions, with pre-installed and validated operating systems such as ctrlX OS, Ubuntu, and RT Linux, alongside optional system consolidation via aReady.VT and IoT connectivity through aReady.IOT. On request, these modules can be pre-configured with the customer’s application, allowing for seamless plug-and-play integration into final systems.
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